SIGMA+ for HP
Your Go-To Solvent for
Unstoppable Performance
Fast-drying SIGMA+ offers excellent adhesion on non-absorbent surfaces, including metals, glass, and plastics.
Benefits of Patented SIGMA+ Solvent Ink
- Rapid drying
- High optical density
- Non-CMR and PFAS-Free
- Extended decap
- Exceptional adhesion
- Superior substrate wetting
NEXXO for Funai
Coding and Marking Ink Goes the Distance
NEXXO solvent ink for Funai opens new possibilities for marking and coding on non-porous curved and recessed surfaces with TIJ technology. NEXXO delivers high-resolution 2D coding with clear, readable characters at a 12.8mm throw distance.
Printing Text, Barcodes, and Graphics
- Metal cans
- Glass bottles
- Plastic jugs and bottles
- Foils
- Glossy Paper
Flexible Packaging Inks
Innovation for Flexible Packaging
Our high-performance piezo inks for food packaging and labels provide vibrant colors and excellent adhesion on films, foils, and flexible packaging.
Discuss These Options
Private Label Inks for OEMs
Your Equipment, Our Ink
Talk to us about your integrated packaging equipment solutions. We partner with OEMs to provide high-performance inks that enhance productivity and reduce costs.
Printing on Cardboard
Unbox Superior Printing Performance
Kao Collins inks provide the high-octane boost for exceptional cardboard printing, ensuring eye-catching packaging, addressing, sharp barcodes, and vivid point-of-purchase displays.
Our Team at Pack Expo
You may have spoken with them on the phone, corresponded by email, or connected at other shows. They’re ready to help at Pack Expo.
Business Development Manager
Business Development Manager
R&D Project Leader
Vice President – Sales, Marketing, Customer Service
Marketing Manager
Product Development Chemist
Custom Solutions
Our Chemists, Your Printing Challenge
Let us know if you’ll be stopping by our booth in the PACKage Printing Pavilion, and we’ll have information ready to address your printing challenges. Connect with our chemists to explore ink solutions and the results you need.